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[优化]：一些问题及需要优化的部分 #2

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swpfY opened this issue Nov 8, 2022 · 1 comment

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swpfY commented Nov 8, 2022

问题：

为树莓派Pico直接供电的是VSYS，为5V，因此通过3v3不能直接通过调试器为Pico供电，需要外接电源

优化计划：

将RP-Link的输出电压调整为VSYS
优化元器件布局和PCB布线

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swpfY commented Nov 8, 2022

PCB焊接过程中的一些注意事项：

led 不耐高温，使用高温焊锡时不能长时间放置在加热台上，可以在其它元件贴完后在用烙铁焊接
对于 QFN、USON-8 这类封装以及 USB-C 这类焊盘较多较密的元器件，可以在其它焊盘较少的元器件贴完后再贴。在焊盘上涂上锡膏后先不贴上，放置在加热台上加热然后观察焊盘上的锡未贴在一起后再将元器件贴上去。（我感觉此方法有效🤔）
0402 封装虽然小但其实也是可以焊接上的🤪

swpfY added the enhancement label

swpfY added a commit that referenced this issue


          修复一些问题

fecd37c

#2

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