Rev D1 Faraday Hardware Design #41
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…ors left. Still need to redo stackup impedance traces and grounding fences that were removed.
…DO GROUND FENCING
…too large of a voltage drop... woops. Also added via fences back in.
…ions were used. Also added a few notes such as LED color. Output new PDF of Schematics and updated Rev to Rev D1 for PCB:NG
…ayer copper pullback. Also updated Via Fencing. Work captured on Hardware Issue #31 on Github.
… Rev d fabrication zip file. Also combined NPTH and plated TH drill files into faraday-all.drl. Updated read.me in fab zip file to summarize the new combined drill file. Advanced Circuits freedfm seems to have passed!
…4.1 mils on this board with still some more DFM issues to work though. Moved some of the reference designtors in the process...
…ages. Definitely need to revisit board ref des placement and such again and export clean gerbers/drill files!
…ators/silkscreen text and layer by layer stackup orientation.
…new netlist and pull it into the PCB and generate new gerbers to ensure nothing was accidentally missed
…as assembly zip update.
…so realizes I didn't have the INSERT set for fiducials so I set that an exported XY position/rotation data for fiducials.
…d gerbers and drill files relative to aux axis for PCB:NG.
… with Brent @kb1lqd. Fixed an issue I found with the soldermask on pins 1 and 16 of the CC1190 so they used the global setting. Lastly, checked the BOM and pick and place files extensively, optimized for FaradayRF/PCB:NG use. Exported new PDF schematic.
…e csv pick and place to the zip assembly file.
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Closing since my next commit adds the CSV assembly file to the assembly zip. |
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Massive update from Rev C design in terms of optimizations. Most changes include simplification of the power supply and DNPing various parts. Another huge update was pulling back the ground pours near the RF traces and making better via fences. No Rev C boards were ever built. Instead we opted to go immediately to Rev D1.
Rev D1 is a Rev D Faraday optimized for PCB:NG manufacturing. Largely this involves PCB stack-up for 50 Ohm impedance traces. We will not be controlling impedance during manufacturing but it's best to get close! Likely good enough per our current testing.