Closed-Form Global Optimization of Beyond Diagonal Reconfigurable Intelligent Surfaces

This code package is related to the paper:

M. Nerini, S. Shen, and B. Clerckx, "Closed-Form Global Optimization of Beyond Diagonal Reconfigurable Intelligent Surfaces," IEEE Trans. Wireless Commun., 2023.

Content of Code Package

The file main_Figi.m reproduces Fig. i in the paper, for i = 2, ..., 8.